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US Patent Issued to Samsung Display on Sept. 8 for "Display device, method of manufacturing the same, and tiled display device having the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,552, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device, method of manufacturing the sam... Read More


US Patent Issued to Samsung Display on Sept. 8 for "Light emitting display device, and car having light emitting display device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,553, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Light emitting display device, and car having l... Read More


US Patent Issued to LG Display on Sept. 8 for "Light emitting display device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,554, issued on Sept. 8, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Light emitting display device" was invented by Joonsuk L... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Sept. 8 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,555, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Hy... Read More


US Patent Issued to Intel on Sept. 8 for "Offset interposers for large-bottom packages and large-die package-on-package structures" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,556, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Offset interposers for large-bottom packages and large-die pack... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 8 for "Semiconductor device and method of manufacture" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,557, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More


US Patent Issued to TEXAS INSTRUMENTS on Sept. 8 for "Configurable leaded package" (Texas Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,558, issued on Sept. 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Configurable leaded package" was invented by Sreenivasan Kalyani ... Read More


US Patent Issued to Amkor Technology Singapore Holding on Sept. 8 for "Electronic devices and methods of manufacturing electronic devices" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,559, issued on Sept. 8, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More


US Patent Issued to GLOBALFOUNDRIES U.S. on Sept. 8 for "Hybrid bonding with selectively formed dielectric material" (New York Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,560, issued on Sept. 8, was assigned to GLOBALFOUNDRIES U.S. Inc. (Malta, N.Y.). "Hybrid bonding with selectively formed dielectric materia... Read More


US Patent Issued to Sony Group on Sept. 8 for "Identification of reduced capability user equipment" (Swedish Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,732,797, issued on Sept. 8, was assigned to Sony Group Corp. (Tokyo). "Identification of reduced capability user equipment" was invented by Joh... Read More